Project Name | F3 (低配) | F3(高配) | ||||||
BOM | A1 BOM (Open market) | B1 BOM (Egypt) | C1 BOM(Ethiopia&Southeast Asia) | A2 BOM (Open market) | B2 BOM(Egypt) | C2 BOM(Ethiopia&Southeast Asia) | D1 BOM(South America) | E1 BOM (Thailand) |
Device Label | ||||||||
Main Board Code | 12103278 | 12103279 | 12103280 | 12103281 | 12103282 | 12103283 | 12103557 | 12103628 |
Sub Board Code | 12103284 | 12103629 | ||||||
Memory | 8GB+1GB | 8GB+1GB | 8GB+1GB | 16GB+1GB | 16GB+1GB | 16GB+1GB | 16GB+1GB | 16GB+1GB |
Back Camera | 5M | 5M | 5M | 8M | 8M | 8M | 8M | 8M |
TP | 2D | 2D | 2D | 2.5D | 2.5D | 2.5D | 2.5D | 2.5D |
Printed on the PCBA | ||||||||
Software(.E.G) | F3-H8022AC-N-180620V123 | F3-H8022B-N-EG-180620V40 | F3-H8022AC-N-180620V123 | F3-H8022ACDE-N-13M-180626V68 | F3-H8022B-N-EG-13M-180611V7 | F3-H8022ACDE-N-13M-180626V68 |